Heterogeneous Integration for High-Performance Automotive Computing

Proposals are expected to encompass at least the following elements:

1. Automotive chiplet system framework: Develop and implement the architectural and design specifications for an automotive chiplet-based computing platform, taking into consideration any relevant standards and industry wide collaborations in this field.
2. Adaptation of relevant IP: Where necessary, adapt pertinent intellectual property (IP) to support seamless chiplet integration within the automotive context.
3. Automotive base die development: Development of an automotive base die for the orchestration of in-package computing with adequate process workflows.
4. System Integration and Packaging: integrate the system and develop the package taking into consideration automotive requirements.

Complementarity with the RISC-V Automotive Hardware Platform topic is expected. For the purposes of intermediate physical demonstrators, non-RISC-V based IP may be considered for in-package integration. Collaboration with the Chips for Europe Initiative pilot lines is encouraged. Nevertheless, the final deliverable for this project should include components developed under the RISC-V Automotive Hardware Platform call - particularly the application processor and AI accelerators - integrated with other IP via the chiplet platform developed under this call.