Closed

Horizon-ju-chips-2025-csa-jpn

HORIZON JU Coordination and Support Actions

Basic Information

Identifier
HORIZON-JU-CHIPS-2025-CSA-JPN
Programme
HORIZON-JU-CHIPS-2025-CSA-JPN
Programme Period
2021 - 2027
Status
Closed (31094503)
Opening Date
July 8, 2025
Deadline
September 17, 2025
Deadline Model
single-stage
Budget
€1,000,000
Min Grant Amount
€500,000
Max Grant Amount
€1,000,000
Expected Number of Grants
1
Keywords
HORIZON-JU-CHIPS-2025-CSA-JPNHORIZON-JU-CHIPS-2025-CSA-JPN

Description

Expected Outcome:
  • Coordinate ongoing Japanese and EU R&I activities on life cycle assessment (LCA) of semiconductor manufacturing processes and facilitate exchange of researchers to improve coherence.
  • Support joint R&I activities between the EU and Japan
  • Contribute to preparing potential future joint EU-Japan R&I collaboration topics in the field of semiconductors.
  • Explore opportunities to finance talent exchanges between R&D or production sites in both regions.
  • Foster increased cooperation with appropriate research institutions in Japan on the development, deployment and commercialisation of digital technologies, for example through specific collaboration in the field of R&I.
  • Support joint activities of companies in the semiconductor value chain to improve security of supply for chips.
Scope:

The scope includes, but is not limited to, the following areas:

• Organize and support networks, conferences, workshops and other actions that: o support semiconductor joint EU-Japan R&I activities, in particular to generate R&I priorities for potential future collaboration. o Connect EU and Japanese companies in the semiconductor value chain to exchange information and propose measures to improve chip supply chain stability.

• Support exchange of researchers and closer coordination of running R&I activities in both regions which address equal or similar objectivities, for instance on the development of a reference database for Life Cycle Assessment or Green House Gas emission in semiconductor manufacturing processes.

• Increased networking and collaboration of stakeholders from the EU and Japan with a view to addressing current needs, considering future requirements and stimulating long-term cooperation.

• The action should ensure that relevant stakeholders from both the EU and Japan are engaged during the process through regional and international workshops and a set of communication and dissemination actions.

Eligibility & Conditions

General conditions

1. Admissibility Conditions: Proposal page limit and layout

described in Appendix 5 of the Multi Annual Work Programme of Chips JU.

Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.

3. Other Eligible Conditions

4. Financial and operational capacity and exclusion

described in Annex C of the Work Programme General Annexes.

5a. Evaluation and award: Award criteria, scoring and thresholds

5b. Evaluation and award: Submission and evaluation processes

5c. Evaluation and award: Indicative timeline for evaluation and grant agreement

6. Legal and financial set-up of the grants

described in Appendix 5 of the Multi Annual Work Programme of Chips JU and in Annex G of the Work Programme General Annexes.

Support & Resources

For help related to this call, please contact: [email protected]

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Latest Updates

Last Changed: August 28, 2025

Expected outcomes (updated text) :

·Support joint activities of companies in the semiconductor value chain to improve security of supply for chips and increase the resilience of the ecosystems in the EU and Japan.

·Support joint R&I and industrial cooperation activities between the EU and Japan

·Contribute to preparing potential future joint EU-Japan R&I collaboration topics in the field of semiconductors.

·Explore opportunities to finance talent exchanges between R&D or production sites in both regions.

·Foster increased EU-Japan cooperation with appropriate research institutions and semiconductor companies in Japan on the development, deployment and commercialisation of digital technologies, for example through specific collaboration in the field of R&I or matchmaking events.

·Coordinate ongoing Japanese and EU R&I activities on life cycle assessment (LCA) of semiconductor manufacturing processes and facilitate exchange of researchers to improve coherence.

Last Changed: July 8, 2025

IMPORTANT INFO:

  1. Japanese entities can join the EU applicants in this action; however, they will not be eligible for EU funding and will have to rely on other or their own source of funding. The participation of Japanese entities is not an admissibility/eligibility requirement.
  2. The requirement of applicants composed of at least three independent institutions from three different EU Member States or Associated Countries, including at least one institution from an EU Member State, applies to this call.
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