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EIC Pathfinder Challenge: Responsible Electronics

HORIZON EIC Grants

Basic Information

Identifier
HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-04
Programme
EIC Pathfinder Challenges 2023
Programme Period
2021 - 2027
Status
Closed (31094503)
Opening Date
June 20, 2023
Deadline
October 25, 2023
Deadline Model
single-stage
Budget
€163,500,000
Min Grant Amount
€500,000
Max Grant Amount
€4,000,000
Expected Number of Grants
10
Keywords
HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-04HORIZON-EIC-2023-PATHFINDERCHALLENGES-01

Description

Scope:

Background and scope

Responsible electronics represents a unique opportunity for the future of EU industrial autonomy in a decarbonised and digital society, however fundamental scientific and technological challenges remain to be addressed. It has been predicted that by 2050, the production of electronics components and devices will rise exponentially and thus the use of raw materials in the sector will increase accordingly. As a result, the amount of electronic waste is also set to rise massively.

Responsible electronics can contribute to drastically reducing the environmental load of the electronic industry by shifting from traditional manufacturing industrial methods to innovative methods and materials with a lower environmental impact. This is in line with the EU Circular Economy Action Plan [1] fostering research towards a circular economy with effective waste and carbon recycling strategies as well as complementary with the objectives of the European Chips Act [2].

Besides reducing the environmental impact of the electronics sector, innovations such as sustainable manufacturing or bio-inspired electronic systems can help Europe overcome the current chips crisis by reducing the dependency on critical raw materials [3] and traditional high energy demanding semiconductor processes. Moreover, investing in responsible electronics would be beneficial for the entire semiconductor ecosystem in Europe and will uphold the EU technology sovereignty.

Overall goal and specific objectives

The overall goal of this Challenge is to create opportunities for discovery of new environmentally friendly electronic materials, thus reducing its environmental impact and the need for critical raw materials and hazardous chemicals.

The projects supported under this Challenge are expected to offer either materials with improved properties (such as flexibility, durability, end of life recyclability/reusability), materials processed with low energy consumption and low carbon footprint processing (such as printing instead of photolithography, avoiding use of fluorinated gases for patterning), or alternatives, including nano-sized ones, to replace common electronic materials such as silicon and silicon nitride.

The specific objectives of this Challenge are to support the scientific community in reaching breakthroughs in development/discovery of:

  • Advanced electronic materials for unconventional devices:
  • small-molecule and polymeric organic materials,
  • solution-processable inorganic materials,
  • hybrid organic-inorganic materials,
  • polymer-matrix nano-composite materials,
  • bio-based and nature-inspired materials
  • for the manufacturing of n- and p-semiconductors, dielectrics, conductors, including transparent conductors, particularly those suitable to make functional inks, passivation/encapsulation/packaging materials, flexible/stretchable substrates, etc.
  • Advanced processes:
  • production methods based on solution processing such as blade coating, slot die coating, spray coating, screen printing, inkjet printing, offset, gravure and flexo-printing, or
  • other techniques particularly suitable for sheet-to-sheet or roll-to-roll manufacturing.
  • Unconventional applications including e-textile/e-skin:
  • backplane and logic circuits,
  • microprocessors (4-8 bits),
  • sensors,
  • displays,
  • power supplies,
  • wireless transmitters/receivers, etc.

particularly those suitable for Internet-of-Thing (IoT) applications, while applying the life-cycle thinking approach.

Expected outcomes and impacts

This Challenge is expected to contribute to the development of materials with new properties or replacing materials used in current electronic devices with materials, which:

  • reduce dependency on critical raw materials,
  • are sustainable: having a low environmental footprint and developed recurring to the life cycle thinking approach.

The overall outcome of this Challenge is to support the move from traditional materials and manufacturing processes to less environmental impactful ones. It is expected that the Challenge will lead to the development of lab-scale validated proof of concept devices based on the developed innovative materials and manufacturing processes, which may represent a potential application of a more sustainable, trusted and secure electronics.

Specific conditions

Projects with multidisciplinary and cross-sectorial approaches, looking for inspiration, ideas and knowledge in a broad range of disciplines are particularly welcome.

The safe and sustainable use of non-critical raw materials or the full recycle/reuse of them is mandatory. All projects are expected to conduct a full life cycle analysis of the proposed solutions and they shall apply or identify a methodology to measure the environmental and/or carbon footprint of the proof of principle/s that will be developed during the project.

Applicants should ensure that the proposed method/technology/material/s is not harmful to the natural ecosystems. Packaging and durability should be taken into consideration.

For more details, see the WP 2023.

[1] Circular economy action plan (europa.eu)

[2] European Chips Act | Shaping Europe’s digital future (europa.eu)

[3] Critical raw materials (europa.eu)

Eligibility & Conditions

General conditions

1. Admissibility conditions:

In order to apply, your proposal must meet the general as well as possible specific eligibility requirements for this Challenge (Please see TOPIC DESCRIPTION above).

The EIC Pathfinder Challenges support collaborative or individual research and innovation from consortia or from single legal entities established in a Member State or an Associated Country. In case of a consortium your proposal must be submitted by the coordinator on behalf of the consortium. Consortia of two entities must be comprised of independent legal entities from two different Member States or Associated Countries. Consortia of three or more entities must include as beneficiaries at least three legal entities, independent from each other and each established in a different country as follows:

  • at least one legal entity established in a Member State; and
  • at least two other independent legal entities, each established in different Member States or Associated Countries.

 

The legal entities may for example be universities, research organisations, SMEs, start-ups, natural persons. In the case of single beneficiary projects, mid-caps and larger companies will not be permitted.

Your proposal will only be evaluated if it is admissible and eligible. The standard admissibility and eligibility conditions and the eligibility of applicants from third countries are detailed in Annex 2. EIC Work Programme 2023.

2. Proposal page limits and layout:

Described in Part B of the Application Form available in the Submission System.

Sections 1 to 3 of the part B of your proposal, corresponding respectively to the evaluation criteria Excellence, Impact, and Quality and Efficiency of the Implementation, must consist of a maximum of 25 A4 pages. Excess pages will be automatically made invisible, and will not be taken into consideration by the evaluators. Please also consult Annex 2 of the EIC Work Programme 2023.

 

3. Financial and operational capacity and exclusion:

Described in Annex 2 of the EIC Work Programme 2023.

 

5. Legal and financial set-up of the grants:

Please refer to the Model Grant Agreement (MGA) used for EIC actions under Horizon Europe

 

 

 

 

Support & Resources

Online Manual is your guide on the procedures from proposal submission to managing your grant.

Horizon Europe Programme Guide contains the detailed guidance to the structure, budget and political priorities of Horizon Europe.

Funding & Tenders Portal FAQ – find the answers to most frequently asked questions on submission of proposals, evaluation and grant management.

Research Enquiry Service – ask questions about any aspect of European research in general and the EU Research Framework Programmes in particular.

National Contact Points (NCPs) – get guidance, practical information and assistance on participation in Horizon Europe. There are also NCPs in many non-EU and non-associated countries (‘third-countries’).

Enterprise Europe Network – contact your EEN national contact for advice to businesses with special focus on SMEs. The support includes guidance on the EU research funding.

IT Helpdesk – contact the Funding & Tenders Portal IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc.

European IPR Helpdesk assists you on intellectual property issues.

CEN-CENELEC Research Helpdesk and ETSI Research Helpdesk – the European Standards Organisations advise you how to tackle standardisation in your project proposal.  

The European Charter for Researchers and the Code of Conduct for their recruitment – consult the general principles and requirements specifying the roles, responsibilities and entitlements of researchers, employers and funders of researchers.

Partner Search Services help you find a partner organisation for your proposal.

 

Latest Updates

Last Changed: October 18, 2023

 

Deadline extension for the EIC PATHFINDER CHALLENGES 2023 call following Hamas’ terrorist attacks across Israel

In light of the disruptions caused by the fallout of Hamas’ terrorist attacks across Israel, the European Commission has carefully assessed the challenges experienced by partner organisations in the region. We acknowledge that these circumstances make it difficult to timely complete and submit proposals to some Horizon Europe calls with deadlines in the coming days and weeks.

As a result, the deadline for the EIC Pathfinder Challenges call has been extended to 25 October 2023 at 17:00 (CET).

Last Changed: October 17, 2023
The submission session is now available for: HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-04(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-02(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-01(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-03(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-05(HORIZON-EIC)
Last Changed: September 19, 2023

Dear Proposer,

Some links to the EIC 2023 WP were corrupted. The issue has been fixed.

Regards

Last Changed: June 30, 2023

Dear Proposer,

The template of Standard Application Form (EIC Work Programme 2023) is now available in the section “Topic conditions and documents” of the call page in the Funding and Tenders portal

The template available in the submission system that is the one to be used for submission, is the correct one and remains unchanged.

Regards

Last Changed: June 20, 2023
The submission session is now available for: HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-04(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-02(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-01(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-03(HORIZON-EIC), HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-05(HORIZON-EIC)
EIC Pathfinder Challenge: Responsible Electronics | Grantalist