Lab To Fab Accelerators For Advanced Packaging And Heterogeneous Integration
DIGITAL JU Simple Grants
Basic Information
- Identifier
- DIGITAL-JU-Chips-2025-SG-LFA
- Programme
- Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration
- Programme Period
- 2021 - 2027
- Status
- Open (31094502)
- Opening Date
- December 3, 2025
- Deadline
- February 25, 2026
- Deadline Model
- single-stage
- Budget
- €50,000,000
- Min Grant Amount
- €500,000
- Max Grant Amount
- €15,000,000
- Expected Number of Grants
- 5
- Keywords
- DIGITAL-JU-Chips-2025-SG-LFADIGITAL-JU-CHIPS-2025-SG-LFA
Description
This topic will open up new opportunities for European-based semiconductor packaging companies and their supply chain by building on currently available services of RTOs and all Chips JU pilot lines. The LFA projects should prepare and speed up the transfer of technologies from pilot lines to industrial deployment.
In addition, projects should expand the advanced packaging ecosystem in Europe and boost its competitiveness by offering a fast path towards industrialization of European semiconductor technology.
Through possible involvement of appropriate actors across the value chain – from materials, substrate, equipment, and test providers through packaging companies and their European customers – proposed projects should build a strong European innovation and transfer ecosystem for advanced packaging solutions, contributing to new and resilient supply chains in Europe.
Eligibility & Conditions
Conditions
1. Admissibility Conditions: Proposal page limit and layout
Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page
The following information are all described in the Appendix 6.v6 of the Chips JU Workprogramme
2. Eligible Countries
3. Other Eligible Conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Submission and evaluation processes
5b. Evaluation and award: Award criteria, scoring and thresholds
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Please visit the Call page of the Chips JU Website
Call document and annexes:
Call document
The Call Documents Section contains all the call documents, which are listed here:
Reference documents
Call submission documents and annexes
Application form template Part B
Ownership declaration template
Model Grant Agreements (MGA)
Additional documents:
Frequently Asked Questions About Lab To Fab Accelerators For Advanced Packaging And Heterogeneous Integration
Support & Resources
For help related to this call, please contact [email protected]
Funding & Tenders Portal FAQ – Submission of proposals.
IT Helpdesk – Contact the IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc.
Online Manual – Step-by-step online guide through the Portal processes from proposal preparation and evaluation to reporting on your ongoing project. Valid for all 2021-2027 programmes.