Advanced Packaging Of Chiplets And Heterogeneous Integration In Europe
DIGITAL JU Coordination and Support Actions
Basic Information
- Identifier
- DIGITAL-JU-Chips-2025-CSA-LFA
- Programme
- Boosting cooperation for industrial implementation on advanced packaging of chiplets and heterogeneous integration in Europe
- Programme Period
- 2021 - 2027
- Status
- Open (31094502)
- Opening Date
- December 3, 2025
- Deadline
- February 25, 2026
- Deadline Model
- single-stage
- Budget
- €2,000,000
- Min Grant Amount
- €500,000
- Max Grant Amount
- €2,000,000
- Expected Number of Grants
- 1
- Keywords
- DIGITAL-JU-Chips-2025-CSA-LFADIGITAL-JU-CHIPS-2025-CSA-LFA
Description
This CSA is expected to deliver a more resilient, sustainable, and competitive European advanced packaging ecosystem through focused collaboration, standardization, and workforce development.
The following outcomes are expected:
-
Resilient & Diversified Supply Chains (Addressing Supply Network Ecosystems)
A demonstrably more resilient European supply chain for advanced packaging, evidenced by a publicly available vulnerability assessment for key sectors (automotive, aerospace, healthcare, security, telecommunications).
-
Sustainable & Resource-Efficient Manufacturing
Reduced environmental footprint of advanced packaging manufacturing in Europe, demonstrated by measurable improvements in resource consumption (materials, energy) and adoption of sustainable design principles.
-
Accelerated Standardization & Interoperability
Increased adoption of standardized technologies for advanced packaging, fostering interoperability and reducing time-to-market for European companies.
-
Enhanced Collaboration & Knowledge Sharing
A strengthened and interconnected European advanced packaging ecosystem, characterized by increased collaboration between research institutions, industry, pilot lines, competence centres, and existing networks (e.g. Pack4EU).
-
Coordinated R&I & Industrial Implementation
A harmonized roadmap for the industrial implementation of research results in advanced packaging, ensuring coherence between EU R&I activities and industry needs.
-
Skilled & Competent Workforce
A skilled workforce equipped to support the growth of the European advanced packaging ecosystem, with increased availability of specialized training programs and upskilling opportunities.
Eligibility & Conditions
Conditions
1. Admissibility Conditions: Proposal page limit and layout
Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page
The following information are all described in the Appendix 6.v6 of the Chips JU Workprogramme
2. Eligible Countries
3. Other Eligible Conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Submission and evaluation processes
5b. Evaluation and award: Award criteria, scoring and thresholds
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Please visit the Call page of the Chips JU Website
Call document and annexes:
Call document
The Call Documents Section contains all the call documents, which are listed here:
Reference documents
Call submission documents and annexes
Application form template Part B
Ownership declaration template
Model Grant Agreements (MGA)
Additional documents:
Frequently Asked Questions About Advanced Packaging Of Chiplets And Heterogeneous Integration In Europe
Support & Resources
For help related to this call, please contact [email protected]
Funding & Tenders Portal FAQ – Submission of proposals.
IT Helpdesk – Contact the IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc.
Online Manual – Step-by-step online guide through the Portal processes from proposal preparation and evaluation to reporting on your ongoing project. Valid for all 2021-2027 programmes.